Final surface treatment to form a void-free, uniform plating film on the circuit surface.
Final surface treatment process on copper circuits using a reduced cobalt catalyst solution! Contributes to improving the reliability of semiconductor packages and printed circuit boards.
Electronic components are mounted on printed circuit boards through wire bonding using gold, copper, or aluminum wires, and solder joints. Servers used for ultra-high-speed communication need to handle large currents and high capacities, requiring further performance enhancements and advanced connection reliability for the semiconductor packages and printed circuit boards used in them. Okuno Pharmaceutical Industry has successfully developed a catalyst solution using cobalt instead of palladium, establishing a final surface treatment process that forms a void-free and uniform plating film on the circuit surface. The ICP-COA process contributes to the reliability improvement of semiconductor packages and printed circuit boards.
- Company：奥野製薬工業 大阪・放出、東京、名古屋など
- Price：Other
